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您現在位置☁·↟│:首頁 > 產品中心 >Logitech精密材料表面處理>薄片製備系統
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  • 產品型號☁·↟│:

    檢視詳細介紹
    Logitech PLJ Precision Lapping Jigs are used to hold multiple “wafer geometry” or slide mounted specimens, while they are being processed on a Logitech precision lapping machine.
  • 產品型號☁·↟│:

    檢視詳細介紹
    The CB30 Bonding Unit and CH30 Hotplate compliment the Compact 50 Thin Section Preparation System. The bonding unit and hotplate are ideal for research or education purposes.
  • 產品型號☁·↟│:

    檢視詳細介紹
    The production of thin and ultra thin sections of materials requires the sample material to be fixed to a substrate (e.g. glass microscope slide) for support during processing.
  • 產品型號☁·↟│:

    檢視詳細介紹
    For easily achievable impregnation results, the CitoVac provides superior capabilities and trouble-free operation. Its spacious vacuum chamber and clear, user-friendly display offers great ease of use
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