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您現在位置✘╃:首頁 > 產品中心 >Logitech精密材料表面處理>精密切割裝置
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    The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics
  • The APD1 is a combined annular and precision saw ideal for slicing wafers, crystals or semiconductor components up to 55mm in diameter. It is also suitable for precision dicing of wafers up to 100mm
  • The GTS1 Thin Section Cut-off and Trim Saw is ideal for geological application areas - cutting hard or soft rocks, concretes or cements with equally high effi ciency.
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