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您現在位置││₪╃▩:首頁>產品中心>Logitech精密材料表面處理>精密切割裝置>AWS1線切割機

線切割機

  • 型   號││₪╃▩:AWS1
  • 價   格││₪╃▩:

The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics

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AWS1線切割機簡介││₪╃▩:

The AWS1 Abrasive Wire Saw allows fragile or diffi cult materials to be cut or wafered without fear of the samples being damaged. Designed for use in photonics, semiconductor, opto-electronics and geological applications, the AWS1 uses fi ne lapping and cutting technology to perform cuts with minimal material loss and minimal sample damage.

Applications

The AWS1 is equally suited to slicing semiconductor and

opto-electronics materials, such as Gallium Arsenide, Silicon or Lithium Niobate, as it is to cutting fragile optical crystals with very little kerf loss. When working with materials of limited integrity,  such as Mercury Cadmium luride, the saw can produce slices of less than half the thickness of those produced using some annular saws. The accuracy and control offered by the AWS1 means that expensive materials, such as Cadmium Zinc luride or YAG laser rods, can be cut more economically than in alternative sawing methods. However, its use is not restricted to these areas and the saw can also be used for cutting geological samples, fossils, teeth, bones, archeological specimens and a range of other materials.

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